It’s getting close to that time of year where chipmakers unveil their new flagship processors that will feature in the next generation of premium smartphones and here with a notable feather in its cap is MediaTek with its announcement that its next Dimensity chipset will be based on the new 3nm manufacturing process. What’s the big deal? Well this means that it will benefit from both speed and power efficiencies which will both make your next smartphone more powerful and last longer than ever before.
Having beaten Qualcomm to the punch, MediaTek’s use of TSMC’s 3nm technology to produce its next-gen flagship processor (rumoured to be the Dimensity 9400) is the latest achievement in the partnership. In terms of numbers, this is what the 3nm process brings to the equation:
- 18% speed improvement at the same power
- 32% power reduction at the same speed
- Around 60% increase in logic density
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
Besides the obvious use in smartphones, the 3nm process will trickle down into MediaTek’s other platforms such as intelligent cars. It’s thought that MediaTek will unveil its next-gen Dimensity processor using the 3nm process sometime in October or perhaps during its Press Summit in November.
