TSMC joins Intel in calls for Congress to hurry up with chip funding



A member of the board at TSMC has echoed calls from Intel and other semiconductor companies for Congress to reach a swift agreement on the CHIPS Act, which is set to unlock $52 billion in federal funding. 

Ming-Hsin Kung, who is also a minister in the Taiwanese government, said in an interview that the pace with which TSMC is able to build its new fabrication facility in Arizona, USA will depend on the ready availability of subsidies.



Source link

Previous articlePNY XLR8 (CS3140) SSD review: A great M.2 SSD that works brilliantly with PC and PlayStation 5
Next articleApple’s iOS 16 said to include a revamped lockscreen with widgets, updated Messages and Health apps – TechCrunch